What the line between two butted tiles really is, which panels and LED modules make it thinnest, and what a printed enclosure will realistically achieve. Includes heat, safety and tolerances. est. = my estimate or engineering assumption, not a datasheet value.
No buyable 10″ square panel has a border under 3.0 mm per side (Youritech ET100SQ01-GX: 185.82 − 179.82 = 6.0 mm → 3.0 mm each, L/R). Today's enclosure (wall 2 + clearance 0.3 + lip 3) gives a spec seam of 10.6 mm, about 11.7 mm realistic. The thinner-panel gain is real but small; the enclosure is the bigger lever.
"Barely noticeable" (≤ 1 mm) is not reachable with a printed enclosure and any buyable small-quantity LCD/OLED. Best realistic: ~3 mm with a flush-edge (glass-to-edge) design on a ~0.9 mm-border OLED, ~1.1 mm extra on LED modules (which butt on the pixel pitch). The ≤1 mm club is video-wall LCDs (0.88 mm spec, ~1.4 mm installed est.) and fine-pitch LED cabinets, none of which are Tyler-sized or buyable singly.
Tail edge: the flex-tail side is far worse than L/R. Current model: 198.7 mm tile pitch − 179.6 mm active ≈ 19 mm vertical seam est. (assumes centred active area). Fix the tail before chasing 0.5 mm elsewhere.
My working rule (a judgement, not a standard): ≤ 1.0 mm combined seam = barely noticeable at normal viewing distance (≥ ~1 m, 1 mm ≈ 3.4 arcmin, reads as a hairline, same class as the 0.88 mm commercial video-wall spec). 1.0–1.5 borderline · ≤ 3 thin line · ≤ 6 clear gap · > 6 a frame. A dark line on a bright image is still visible well below 1 mm up close (< 0.5 m), so treat ≤ 1 mm as "stops being distracting", not "invisible".
Seam = visible dead band between the active areas of two butted tiles, L/R edges. Spec = datasheet numbers + enclosure nominal. Realistic = adds panel outline ±0.2, print ±0.3, active-area offset ±0.2/side, butt gap 0.3 (see Tolerances). Rank uses the flush-edge realistic seam (same order in every enclosure variant). Border per side = (outline − active) ÷ 2 unless marked datasheet drawing. Ranked rows are all buyable in small quantity.
| Item | Class | Border/side | Seam spec | Seam installed | Note |
|---|
Same scale on every row (1 mm = a fixed length; the thin dashed lines mark the 1 mm "barely noticeable" band). Blue = active picture, black = panel border + lip, grey = enclosure wall + clearance, orange = realistic tolerance allowance.
Keep ET100SQ01-GX for now (only buyable 10″ square; 3.0 mm L/R). Gain comes from the enclosure: moving from current to thin-wall cuts realistic seam 11.7 → 10.1 mm; flush-edge → 7.1 mm.
To go below ~6 mm at 10″ you need a custom panel (ask Youritech / Tailor Pixels / All Vision for a ≤1.5 mm-border 10″ square; All Vision "<2.5 mm" is a marketing claim unverified). Add this to the outreach tracker.
Hot Display TFT-H040A20DKINV6N40: 1.451 mm on L/R/top (datasheet drawing) vs 2.54 mm for ET040HD20-K, saves 2.2 mm per joint panel-only. Trade-off: parallel RGB + 3-wire SPI (NV3052C), 600 nit, backlight 16.5 V × 60 mA ≈ 1 W; no MIPI.
If the tile may grow to 5″: ET050SQ01-GX (1.15 mm, MIPI, 400 nit, ~$24).
HUB75 modules are pitch-continuous: the board edge is N × pitch, so the seam is only what the enclosure adds. P3 64×64 = 192 × 192 mm matches the 10″ tile footprint; P2.5 64×64 = 160 mm. With a flush-edge shell the extra is ~1.1 mm (≈ 0.4 px at P2.5); with a thin wall ~4.1 mm (≈ 1.6 px). Edge-LED offset is not published unverified, so measure a sample.
New calc() numbers only: swap panel dimensions (use datasheet 185.82×192.32 / 179.82 for the 10″, currently 186×192 / 179.6); set lip ≤ border (1.45 at the Hot Display) and wall toward 1.2 where the sliders allow. Same layer stack, same magnet pads.
Enclosure redesign needed for: thin wall with magnet/pogo pockets (local inner pads), a re-routed tail edge (the ~19 mm vertical seam), flush-edge / glass-to-edge (back-tray shell, bonded cover, edge protection), a different panel's connector and flex fold, any LED module (new tray, metal back, vents).
| Class | Operating / storage | Heat source | Sealed-tile behaviour |
|---|---|---|---|
| IPS LCD (ET100SQ01-GX, ET050SQ01-GX, Hot Display 4″) | −20…70 °C / −30…80 °C [Youritech pages, Hot Display datasheet] | Backlight. Hot Display 4″: 16.5 V × 60 mA ≈ 1.0 W at 600 nit, LED life 20–30 kh to 50 % at 25 °C (datasheet). Scaled to a 10″ at 1000 nit (area ×6.3, brightness ×1.7) ≈ ~10 W est. (6–15 W); ET100 backlight spec not published. | ~10 W in a ~0.09 m² sealed shell → surface +11–14 K, interior hot spots +25–35 K est. → 55–70 °C in a 30–35 °C room: at the 70 °C limit and above PLA/FR-PETG. High temperature lowers contrast and ages polarizer/backlight films (general knowledge, not sourced). Cap to ~400–500 nit or add a heat path. |
| On-cell AMOLED (2.16″, 3.92″, flexible 6.5″ class) | 2.16″ (Youritech ET022AM01-HT): −20…70 °C / −30…80 °C. 3.92″ and flexible rows: not published in catalogue | Emissive; heat scales with content. 2.16″ well under 1 W est. Blue pixels run hottest. | Low panel heat, but burn-in/aging is temperature-sensitive: in one large-area white OLED study +10 °C cut lifetime 1.65× (not a general rule); a 55″ WRGB display showed visible burn-in after 1000 h of static patches. Static art tiles: add pixel shifting and dimming. |
| HUB75 LED tiles (P2.5 / P3 64×64) | Temperature range not stated on Waveshare page unverified | ≤ 20 W per module at 5 V / 4 A (Waveshare), i.e. ~780 W/m² on a 160 mm board at full white. Typical content 3–8 W est. | Sealed with no airflow, 20 W gives ~+25 K surface est., so needs a metal back, rear vents and a brightness cap. 4 A through edge pogo pins is also a contact-rating question (check the pin rating). |
| Material | Heat (Tg / HDT) | Flammability | Use for Tyler |
|---|---|---|---|
| PLA | Tg 59.7–60.5 °C measured; HDT 57 °C (Bambu), service 50–60 °C (Prusa) | Not rated (typically burns) general knowledge | No for a sealed 10″ tile (will creep at 55–60 °C) |
| PETG | Tg 78.7–81.2 °C; service 70–90 °C (Prusa) | Not rated; FR variants: Prusament PETG V0 UL94 V-0 (≥ 0.75 mm); Spectrum FR PETG "designed to meet" V-0, but HDT only 58–63 °C | Minimum; non-FR OK for prototypes |
| ASA / ABS | ASA Tg 103.7 °C (service 90–110 °C); ABS Tg 107.5 °C (95–110 °C) | Not rated; Spectrum FlameGuard ASA "designed to meet" V-0 (1.6 mm), HDT 86 °C | Good default shell |
| PC / PC-ABS | PC Tg 147.5 °C (service 100–115 °C) | PC inherently better; Spectrum PC/ABS FR V0: V-0 at 1.5 and 3.0 mm, HDT 90 °C (claimed, not UL-listed) | Best if you need V-0 near the battery |